Hot Job Openings
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CTO
Require
- 15+ years of experience in the semiconductor industry, including 10+ years in technical management roles
- Master's degree or above in Microelectronics, Electronic Engineering, Materials Science, or related disciplines
- Strong knowledge of chip design methodologies and semiconductor manufacturing processes
- Extensive experience in analog and digital circuit design, EDA tools, and end-to-end chip development
- Understanding of market requirements, product definition, and application solution development
- Deep understanding of silicon-based passive devices, including design, simulation, testing, and validation processes
- Familiarity with advanced packaging technologies such as WLP, SiP, and 3D packaging, with experience in package design and process optimization
- Strong chip design expertise and technical foundation
- Excellent leadership, communication, and cross-functional collaboration skills
- Proficiency in English with the ability to participate in international technical discussions
Content
- Develop the company's technology strategy and R&D roadmap, ensuring alignment with business objectives
- Lead the chip design team and oversee product quality, innovation, and technical direction
- Drive the development and process optimization of silicon-based passive devices
- Lead research and implementation of advanced packaging technologies to enhance product competitiveness
- Establish and improve R&D systems, processes, and technical management frameworks
- Build, mentor, and develop high-performing engineering teams
- Monitor industry trends and emerging technologies to maintain technological leadership
- Coordinate cross-functional technical collaboration and manage the entire product lifecycle from R&D to mass production
An experienced technology leader with over 15 years of semiconductor industry experience, deep expertise in silicon-based passive devices and advanced packaging technologies, and strong capabilities in technology strategy and team leadership.
Deliveryfoundry interface
Require
- Bachelor's degree or above in Microelectronics, Electronic Engineering, Materials Science, or related fields
- 5+ years of semiconductor industry experience; background in silicon-based passive devices or RF components is preferred
- Familiarity with the complete Tape-Out (TO) process and proven experience independently leading TO projects
- Hands-on experience with multiple foundries and strong understanding of different process technologies
- Deep understanding of Foundry PDK architecture, evaluation, and deployment
- Proficient with industry-standard EDA tools such as Virtuoso, Calibre, and IC Validator
- Familiarity with semiconductor manufacturing processes and silicon-based passive device fabrication technologies
- Strong expertise in physical verification methodologies including DRC, LVS, and PEX
- Understanding of IC layout design flows, physical design constraints, and layout rules
- Strong programming skills with proficiency in Python, Tcl, SKILL, or similar scripting languages
- Familiarity with AI-assisted engineering tools and the ability to leverage them in design workflows
- Good English reading and writing skills, capable of reviewing technical documentation and communicating with foundry partners
- Preferred Qualifications
- Experience with AI-driven design automation projects
- Experience collaborating with AI solution providers or deployment partners
- Strong software development and scripting capabilities
- Experience coordinating projects across multiple foundries
- Team leadership or project management experience
Content
- Serve as the primary technical interface with multiple semiconductor foundries and maintain long-term collaboration relationships
- Lead the complete Tape-Out (TO) process from planning through manufacturing release
- Coordinate process integration, PDK adaptation, and wafer fabrication schedules between internal design teams and foundries
- Evaluate, validate, and maintain foundry PDKs to ensure compatibility with internal design flows
- Support layout teams in resolving physical verification issues and managing DRC, LVS, and PEX sign-off activities
- Track wafer fabrication progress across multiple foundries and coordinate resolution of technical issues
- Participate in AI-driven design automation initiatives and collaborate with external AI technology partners
- Develop and maintain technical documentation, best practices, and knowledge bases related to Tape-Out processes
An experienced Foundry Interface Engineer with 5+ years of semiconductor industry experience, expertise in multi-foundry Tape-Out execution and PDK integration, and the ability to collaborate efficiently on AI-assisted design automation projects.
DeliverySenior Project Manager
Require
- Bachelor's degree or above in Electronic Engineering, Microelectronics, Semiconductor Engineering, or related fields
- 5+ years of project management experience in semiconductor design companies, with successful mass-production project experience
- Strong understanding of the complete semiconductor lifecycle, including chip design, wafer fabrication, testing, and packaging
- Extensive knowledge of wafer manufacturing processes and mainstream foundries such as TSMC and SMIC
- Familiarity with chip testing methodologies, ATE equipment, and test program development
- Understanding of packaging technologies including QFN, BGA, SiP, and reliability qualification standards
- Excellent communication, coordination, and cross-functional collaboration skills
- Strong risk assessment and problem-solving capabilities
- Good English reading and writing skills for international business communication
Content
- Lead the planning, execution, and delivery of semiconductor projects, including schedules, milestones, and budgets
- Coordinate internal engineering teams and external partners to ensure efficient resource allocation
- Provide regular project status updates and proactively identify and mitigate project risks
- Manage wafer fabrication activities and coordinate with foundry partners
- Oversee chip testing activities, including CP (Chip Probe) and FT (Final Test)
- Supervise packaging processes to ensure yield, reliability, and quality targets are achieved
- Establish and maintain quality management systems and drive continuous improvement initiatives
- Lead cross-functional collaboration among design, verification, testing, manufacturing, and operations teams
- Mentor project team members and strengthen overall project management capabilities
An experienced semiconductor project manager with 5+ years of project management experience, expertise across wafer fabrication, testing, and packaging, and a proven track record of driving successful mass-production programs.
DeliverySales Manager
Require
- Bachelor's degree or above in Electronics, Telecommunications, Marketing, or related fields
- 5+ years of experience in electronic component sales, including at least 2 years of team management experience
- Existing customer relationships within the optical communications industry are highly preferred
- Proven track record in key account development and management of million-dollar sales opportunities
- Strong market insight and strategic thinking capabilities
- Excellent team leadership and cross-functional coordination skills
- Outstanding business negotiation and customer relationship management abilities
- Highly motivated, results-oriented, and capable of frequent business travel
Content
- Develop and execute regional and industry-focused sales strategies to achieve annual revenue targets
- Identify and expand key accounts within the optical communications market and establish long-term strategic partnerships
- Analyze market trends, customer needs, and competitive dynamics to develop differentiated sales approaches
- Lead, mentor, and develop sales teams to strengthen overall performance and organizational capabilities
- Coordinate with R&D, manufacturing, and supply chain teams to ensure successful delivery of major customer projects
An experienced sales leader with 5+ years of electronic component sales experience, strong customer relationships in the optical communications industry, proven success in managing million-dollar projects, and the ability to lead high-performing sales tea
DeliverySales Engineer
Require
- Bachelor's degree or above in Electronics, Telecommunications, Microelectronics, or related fields
- 1–3 years of experience in electronic component sales or FAE roles; experience in optical communications is preferred
- Basic understanding of silicon-based semiconductor devices, such as optical module ICs, laser driver ICs, and related components
- Strong customer development skills and business negotiation capabilities
- Ability to quickly understand technical products and communicate their value to customers
- Excellent communication, coordination, and teamwork skills
- Willingness to travel and ability to perform effectively in a fast-paced environment
Content
- Develop new business opportunities and customer relationships for silicon-based electronic components to achieve sales targets
- Understand customer requirements within the optical communications industry and provide professional technical solution support
- Maintain existing customer relationships and follow up on order fulfillment and after-sales activities
- Collect market intelligence and competitive information, providing feedback to product and marketing teams
- Collaborate with engineering teams to support product selection, evaluation, and application guidance for customers
A motivated Sales Engineer with 1–3 years of experience in electronic component sales or field application engineering (FAE), familiarity with silicon-based semiconductor devices, and the ability to develop customers and support business growth in the opt
DeliveryAt Launchip, we offer
Competitive compensation, comprehensive benefits, and continuous growth opportunities, working with an outstanding team to advance the industrialization of hard technologies.
Competitive Compensation
Base salary + year-end bonus + project bonus, annual salary adjustment based on performance
Comprehensive Benefits
Five social insurances and one housing fund + supplementary commercial insurance, safeguarding your health and family
Flexible Working Hours
Results-oriented, work-life balance, paid annual leave + flexible attendance
Continuous growth
Technical sharing, training opportunities, industry exchanges, supporting your career advancement
Heartwarming benefits
Holiday benefits + birthday bonus + team building, making work more humane
Long-term incentives
Employee Stock Ownership Plan: Growing and Sharing Value with the Company
Participating in Cutting-Edge Projects
Deeply Involved in High-End Application Scenarios such as AI, Optical Communication, and Automotive Electronics
Broad Development Opportunities
Clear Career Advancement Path: Growing with the Company