Leveraging advanced silicon passive technology, our embedded capacitor solutions provide exceptional capacitance density, ultra-low ESL, and compact form factors for AI accelerators, server platforms, optical interconnects, and next-generation packaging architectures.
Designed for next-generation 1.6T and 3.2T optical transceivers, our ultra-high-frequency silicon capacitors deliver exceptionally low insertion loss, helping preserve signal integrity at ultra-high data rates.
Covering silicon capacitors and silicon resistors with over 100 production models, supporting customized dimensions, specifications, and packaging for AI computing, optical communications, and other advanced applications.
Providing high-frequency, low-parasitic, and highly integrated silicon passive solutions for AI/HPC, SoC, high-speed optical modules, 5G communications, and automotive LiDAR applications.
Capacitance density up to 2μF/mm² and ESL as low as 2.9pH, optimized for high-speed transient response and near-die decoupling in AI processors.
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Silicon Capacitors/Resistors for Co-Packaged Integration and Power Optimization, Featuring an Ultra-Thin Structure Embedded in Advanced Packaging to Improve SoC Efficiency and Miniaturization.
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67GHz+ Ultra-High-Frequency Silicon Capacitors Support Biasing and Decoupling for 800G/1.6T Optical Modules, Reducing Link Loss and Jitter.
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High-frequency silicon capacitors and inductors with low insertion loss and high Q factor, optimized for RF front-end, mmWave, and base station subsystems to ensure 5G signal integrity.
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High-voltage silicon capacitors (100–150V) with ultra-low ESL design for pulse driver circuits, enhancing detection range and system reliability.
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As the industry accelerates toward next-generation 1.6T optical modules, requirements for ultra-high frequency performance, thermal stability, reliability, and miniaturization continue to rise. To address the challenges of signa
Engage with our engineering team to assess the deployment of 3D Silicon Capacitors, Silicon Inductors, and Silicon Resistors for AI Infrastructure, Optical Networking, LiDAR, RF Modules, and other high-performance electronic systems.