Official Recognition: Launchip’s 3D Silicon Capacitors Selected for the Shanghai Innovative Product Recommendation Catalogue

　　The Shanghai Municipal Commission of Economy and Informatization and the Shanghai Municipal Science and Technology Commission recently issued Document Hu Jing Xin Ji〔2026〕No. 602, officially announcing the 15th Shanghai Innovative Product Recommendation Catalogue. Launchip’s proprietary 3D silicon capacitors were selected as Item No. 69, with the following models included: LHC105SA4K0032, LHC105SA4K0042, and LHC104SA2K0042.

　　The latest catalogue features 126 leading innovative products across strategic emerging industries in Shanghai, including integrated circuits, biomedicine, and artificial intelligence. Core innovations from industry leaders such as Biren Technology and United Imaging Healthcare were also selected, representing the highest level of technological innovation in Shanghai.

01 Small Components Address Major Bottlenecks and Enable High-End Computing Upgrades

　　As AI computing chips and 800G/1.6T high-speed optical modules continue to evolve rapidly, the requirements placed on near-die power delivery and package-level power delivery networks have increased significantly. In advanced process nodes, near-die power delivery, and embedded substrate packaging, conventional multilayer ceramic capacitors (MLCCs) are increasingly constrained by insufficient high-frequency performance, relatively high parasitic parameters, and limited adaptability. These limitations have become critical bottlenecks in advancing high-end hardware performance.

　　To address these industry challenges, Launchip’s proprietary 3D silicon capacitors use mature semiconductor processes to create specialized three-dimensional silicon structures, delivering several key advantages:

• 　　Ultra-high capacitance density, reducing the component footprint and supporting compact advanced packaging;

• 　　Ultra-low parasitic inductance, providing excellent high-frequency performance for high-speed computing and interconnect applications;

• 　　An ultra-thin, integrated form factor, meeting the core requirements of embedded substrate packaging;

• 　　Wide-temperature operation and high reliability, supporting demanding applications in high-end communications, AI computing, aerospace, and precision medical equipment.

　　Launchip has established four comprehensive product series covering high capacitance, high frequency, ultra-high frequency, and high voltage. More than 200 models have entered volume production, addressing a broad range of advanced passive component requirements across different applications.

02 Strong Technology Foundations Enable Volume Production and Commercial Deployment

　　Based in Jiading, Shanghai, Launchip has long focused on the development and commercialization of advanced silicon-based passive devices, including 3D silicon capacitors, silicon resistors, and silicon inductors, helping address domestic technology gaps in advanced packaging.

　　Through its strong technological capabilities, the company has been recognized as a High and New Technology Enterprise and a Shanghai Specialized, Sophisticated, Distinctive, and Innovative Enterprise. It also received first prize in the “Entrepreneurship in Shanghai” Innovation and Entrepreneurship Competition. Its core products have successfully passed AEC-Q200 automotive-grade qualification, providing authoritative recognition of their reliability and suitability for industry applications.

　　Launchip has also made rapid progress in commercialization. Its embedded substrate capacitor products for CPUs and GPUs have entered volume delivery, while its high-speed optical module products are being supplied to leading overseas customers. The company’s current monthly production capacity exceeds 500 million units, serving more than 20 high-quality customers at the validation or volume-production stage.

　　On the capital side, Launchip recently completed a Pre-A+ financing round totaling nearly RMB 200 million, bringing its cumulative financing to nearly RMB 300 million. The continued support of leading industry investors further demonstrates the market potential of domestically developed silicon-based passive devices and Launchip’s core competitiveness.

03 Advancing Silicon-Based Passive Devices to Support Domestic High-End Packaging

　　From proprietary technology development and sample validation to volume production and commercial delivery, Launchip continues to overcome overseas technology barriers and address domestic capability gaps in passive devices for advanced packaging.

　　Looking ahead, the company will continue to deepen its focus on silicon-based passive devices by further developing its four product families covering high capacitance, high frequency, ultra-high frequency, and high voltage. It will accelerate the development of ultra-thin, highly reliable, and automotive-grade devices while advancing 2.5D/3D integration technologies and supporting the transition of silicon-based passive devices from discrete components to integrated solutions.

　　With more comprehensive domestic capabilities, Launchip aims to provide highly reliable, high-performance core solutions for AI computing, high-speed interconnects, and other advanced hardware applications, contributing to greater technological independence across critical segments of China’s integrated circuit industry.