01
High-Quality Supply Chain
Wafer foundry utilizes world-class fabs and mature processes, and packaging/testing partners cover top-tier domestic packaging and testing companies.
Map RS Management under Automotive-Grade Approach
Launchip introduces advanced algorithms into its quality system, identifying and eliminating marginal-performance products by analyzing the test results of each wafer, rather than relying solely on traditional pass/fail criteria.
RS before control
Fail: 1500
RAWMAP 1: GDBN 2: DPAT MERGE
Prober Map Data Map Error Map
Algorithm Filtering
After RS Control
Fail: 2344 (New)
RAWMAP 1: GDBN 2: DPAT MERGE
Merge All
RS: Rejection Selection Map
PAT Algorithm
GDBN Algorithm
Stack mapping Algorithm
Multiple Algorithm for Identifying Edge Products
RS control identifies and eliminates more edge-performing chips, effectively reducing final delivery DPPM, especially suitable for scenarios with high consistency requirements such as AI, optical modules, and automotive electronics.
Full-Process Quality Control System
From wafer manufacturing and packaging/testing to outgoing inspection, a closed-loop quality control system is established to ensure product consistency and reliability.
02
100% Test Screening
Perform 100% CP test and CHAR test to systematically screen key parameters, sample distribution, and performance windows.
03
Reliability Screening & Algorithm Elimination
Combining PAT, GDBN, Stack mapping, and RS control logic, eliminate samples with performance margins and weak dies.
04
Outbound Inspection & Delivery Assurance
100% six-sided OM optical inspection and IR inspection are performed before shipment, and BCM ensures continuous delivery stability.
Full-Process Technical Support and Failure Analysis Closed-Loop
Launchip provides system-level technical support and anomaly response mechanisms aligned with semiconductor industry best practices. From design simulation and product implementation to failure analysis, root-cause identification, and continuous optimization, we work closely with customers throughout the entire product lifecycle.
Design Support & High-Precision Models
Provides accurate S-parameters, SPICE, and RLC models, supports high-precision simulation in HFSS/ADS, and participates in PI/RF collaborative design.
Semiconductor-level Failure Analysis (FA)
Capable of open/short circuit detection, parameter drift analysis, and SEM/FIB root cause localization, completing the problem loop through an 8D process.
Continuous Optimization Loop
Analysis results feed back into design models and production screening strategies, forming a continuous optimization mechanism of 'design participation + model-driven + FA closed loop'.
48h Initial Response
S-parameters/SPICE model
Reliability Report
8D Report Closure
Model-Driven · Precise Design
S-Parameters | SPICE | RLC Model Library
Root Cause Analysis · Rapid Loop Closure
SEM / FIB / 8D Workflow
Data Feedback · Continuous Iteration
Failure Analysis → Model Update → Design Optimization