Launchip Technology Co., LTD
LaunChip

AI/HPC

Capacitance density up to 2μF/mm² and ESL as low as 2.9pH, optimized for high-speed transient response and near-die decoupling in AI processors.

Silicon Capacitor Embedded in RDL Interposer

Silicon capacitors embedded within RDL interposers provide low-impedance power delivery paths for AI accelerators and high-performance computing platforms.

Why Silicon Capacitors?

Embedded within RDL interposers, silicon capacitors provide ultra-low-impedance power delivery networks for AI processors and HPC platforms. By suppressing power noise and minimizing voltage fluctuations, they significantly improve power integrity (PI) and signal integrity (SI), meeting the demanding performance requirements of next-generation high-computing systems.

Challenges of Traditional MLCCs

Limitations
  • Higher ESL limits transient current delivery for AI processors
  • Significant DC Bias effects reduce effective capacitance under load
  • Larger package sizes prevent integration within interposers or near-die locations
  • Longer power paths increase impedance and degrade power integrity

Silicon Capacitor Solution

Advantages
  • Embedded within RDL interposers for the shortest possible power delivery path
  • Ultra-low ESL and ESR for nanosecond-level transient response
  • Exceptional capacitance density in an ultra-compact footprint
  • No DC Bias effect, ensuring stable and predictable capacitance
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Evaluate Silicon Passive Device Integration for Next-Generation Systems

Engage with our engineering team to assess the deployment of 3D Silicon Capacitors, Silicon Inductors, and Silicon Resistors for AI Infrastructure, Optical Networking, LiDAR, RF Modules, and other high-performance electronic systems.

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