Solutions for Key Applications
Providing high-frequency, low-parasitic, and highly integrated silicon passive solutions for AI/HPC, SoC, high-speed optical modules, 5G communications, and automotive LiDAR applications.
Capacitance density up to 2μF/mm² and ESL as low as 2.9pH, optimized for high-speed transient response and near-die decoupling in AI processors.
View Details
Silicon Capacitors/Resistors for Co-Packaged Integration and Power Optimization, Featuring an Ultra-Thin Structure Embedded in Advanced Packaging to Improve SoC Efficiency and Miniaturization.
View Details
67GHz+ Ultra-High-Frequency Silicon Capacitors Support Biasing and Decoupling for 800G/1.6T Optical Modules, Reducing Link Loss and Jitter.
View Details
High-frequency silicon capacitors and inductors with low insertion loss and high Q factor, optimized for RF front-end, mmWave, and base station subsystems to ensure 5G signal integrity.
View Details
High-voltage silicon capacitors (100–150V) with ultra-low ESL design for pulse driver circuits, enhancing detection range and system reliability.
View Details硅基无源器件核心能力
基于半导体工艺的3D硅电容、硅电阻、硅电感，为高端电子系统提供底层技术支撑。