Launchip Secures Nearly RMB 200 Million in Pre-A+ Financing

　　Launchip has announced the completion of a Pre-A+ financing round totaling nearly RMB 200 million. The successful closing reflects strong investor confidence in the company’s core technology roadmap, commercialization capabilities, and long-term growth potential.

　　The new funding will be used primarily to advance Launchip’s chip-scale silicon passive device platform, expand its core team, and acquire key equipment. The investment will also support continued R&D, strengthen manufacturing and delivery capabilities, and accelerate the transition of Launchip’s products into high-volume production and broader commercial deployment.

　　Looking ahead, Launchip will continue to work closely with partners across the semiconductor value chain while deepening its focus on the convergence of advanced packaging and power delivery networks (PDNs). The company remains committed to delivering reliable, foundational component solutions for AI computing and high-speed interconnect applications.