The Chinese Technology Powering 1.6T Optical Modules

As AI computing power continues to surge and data center bandwidth demand grows exponentially, 1.6T optical modules have become one of the core high-speed engines powering the digital era. Amid this global technology race, China's optical communication industry is rapidly advancing, supported by a small yet critical domestic innovation hidden deep within these modules—Launchip's silicon capacitors, delivering the performance foundation required for next-generation high-speed connectivity.

Reaching 1.6T: When Traditional Capacitors Meet Their Limits

As one of the industry's most advanced optical communication technologies, 1.6T optical modules operate at 200G per lane with extremely high integration density, pushing component performance close to physical limits.

Conventional multilayer ceramic capacitors (MLCCs) increasingly face challenges in such demanding environments:

• Higher signal loss at ultra-high frequencies, leading to signal degradation

• Larger package sizes that consume valuable module space

• Noticeable temperature and voltage drift affecting long-term reliability

At the same time, the high-end passive component market has long been dominated by overseas suppliers, creating a critical bottleneck for the localization of advanced optical module technologies.

A New Approach: Launchip's LXF Ultra-High-Frequency Series

Rather than following the traditional ceramic capacitor route, Launchip has developed silicon capacitors based on proprietary semiconductor 3D deep-trench technology, providing a new solution for next-generation optical communication systems.

Designed specifically for high-frequency optical module applications, the LXF Ultra-High-Frequency Series offers several key advantages:

Ultra-Low Insertion Loss

With insertion loss below 0.5 dB, stable impedance performance up to 67 GHz, and extremely low ESR and ESL, the LXF series supports high-speed 200 Gbps signal transmission while maintaining excellent signal integrity.

Ultra-Thin Design for High-Density Integration

Featuring a standard thickness of only 100 μm, the devices support backside mounting and help maximize internal space utilization within compact optical module architectures.

Exceptional Reliability for Data Centers

The capacitance remains highly stable across a wide operating temperature range from -55°C to 150°C, with virtually no DC-bias capacitance degradation. The expected service life is up to 20 times longer than conventional MLCC solutions, supporting the continuous 24/7 operation required by modern data centers.

Empowering the Future of High-Speed Connectivity

From initial customer evaluations to upcoming volume production, Launchip's LXF ultra-high-frequency silicon capacitors have successfully entered the supply chain of next-generation 1.6T optical modules and have passed rigorous validation by multiple industry-leading customers.

Today, Chinese optical module manufacturers have established global leadership in areas such as packaging and optical coupling technologies. Combined with breakthroughs in critical foundational components like silicon capacitors, the industry's goal of building a fully localized and resilient high-speed optical communication ecosystem is becoming increasingly achievable.

It does not emit light itself, yet it stands behind the light.

Small in size, yet capable of supporting digital networks transmitting 1.6 trillion bits per second.

Looking ahead to the era of 3.2T optical modules, CPO (Co-Packaged Optics), and future high-speed interconnect technologies, Launchip will continue advancing silicon-based passive device innovation and delivering reliable, high-performance solutions that help power the next generation of global AI infrastructure and data communications.

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Ms. Li
Business Development – AI Computing & SoC Applications

Mr. Liu
Business Development – Optical Communications, Optical Modules & LiDAR Applications